An innerlayer defect found by optical inspection needs a controlled disposition before the layer is hidden inside a multilayer board. The existence of a repair method does not establish that it is permitted for every product. Define the allowable operation and required evidence before corrected material returns to production.
Separate detection from disposition
Record the original defect location, layer, image and applicable design reference. Determine whether it is excess copper, missing copper or another condition. An inspection classification should lead to an authorized decision, not an automatic assumption that the feature can be repaired.
KLA’s automated optical shaping information describes both removal of excess copper and addition where copper is missing. Those equipment functions have defined application conditions; they are not blanket approval to alter any conductor on any customer product.
Make the permission specific
| Decision field | Definition needed |
|---|---|
| Product scope | Which construction and requirements apply? |
| Feature | Which conductor and geometry are affected? |
| Operation | Which approved correction method is proposed? |
| Verification | What demonstrates an acceptable result? |
| Authority | Who can release the corrected layer? |
Review customer restrictions and the applicable manufacturing specification. If the requirement is unclear, resolve it before an irreversible downstream operation hides the corrected feature.
Preserve before-and-after evidence
Use an identifiable coordinate and consistent view for the original and corrected condition. Retain the source data used for comparison and the operation record. A later inspection pass should not erase the fact that a correction occurred.
For example, if excess copper is removed near two adjacent traces, verify the resulting relationship of both conductors and their separation. Checking only that the original bridge disappeared may leave another relevant dimensional question unanswered.
Release into lamination deliberately
- Confirm that the correction was authorized.
- Review the completed verification evidence.
- Identify any additional required examination.
- Associate the layer with its final board or panel history.
- Approve the disposition before layup proceeds.
If the same defect recurs, investigate the upstream cause separately from the repair route. Successful correction can protect a particular lot while still revealing a patterning or handling problem that needs attention.
Retain rejected examples where they help define the process boundary. A collection containing only successful corrections cannot demonstrate what the route must exclude.
Give the corrected feature its own disposition reference when several defects share one panel. An approval for one local operation should remain distinguishable from a decision about another conductor with different geometry or electrical requirements.
The CAM traceability guide supports the reference-data chain. The inspection planning guide helps connect the correction to product-specific acceptance rather than appearance alone.
Move from reading to a build-ready project
Use the fabrication and assembly checklists to prepare drawings, production files and test requirements.
Open the DFM checklist