A via that will become buried offers an inspection opportunity before the next lamination closes over it. Decide what to examine while access exists and how that evidence relates to the finished board. An early pass is useful, but it cannot certify all operations that occur afterward.
Identify the future buried interface
Mark the via generation, connected layers, surface pads and surrounding dielectric in the build sequence. Connect its intermediate location to the final stackup. This prevents a routine through-hole inspection plan from being applied without considering the later buried construction.
Isola’s sequential-lamination note discusses stresses around embedded via structures and neighboring materials. Its discussion supports reviewing the full construction; it does not provide a universal inspection sample size or acceptance rule for every HDI board.
Allocate checks to the accessible stage
| Evidence | Question addressed |
|---|---|
| Surface inspection | Condition of the exposed pad and surrounding region |
| Electrical check | Specified connection in the intermediate construction |
| Representative section | Local internal geometry and material condition |
| Process record | How the interconnection was formed and prepared |
Choose the actual methods and limits under the product’s agreed quality requirements. Different checks reveal different features, and none should be described as complete coverage unless it has that demonstrated scope.
Preserve location and construction identity
Record which subcomposite and panel position produced each result. Include the relevant hole type and local stack. A generic microsection image can be technically sound while representing a different structure from the via that will be buried.
For example, a coupon with a different pad arrangement may not represent the interface being capped by the next layer. Compare the physical construction before using its result to release the product.
Keep the preclosure surface condition protected after inspection. If another treatment or handling step follows, identify whether a later check is needed to represent the state that actually enters lamination.
Connect early evidence to final verification
Perform the required final electrical and reliability checks after the complete route. Compare failures with retained intermediate evidence to identify when the condition may have changed.
If an intermediate result is missing, use the defined disposition process rather than creating an assumed pass from final continuity. The final test may not answer every question the earlier inspection was intended to address.
Review the plan when an additional build-up cycle or via arrangement is introduced. The subcomposite history guide preserves these route differences, while section targeting helps select the actual interface for examination.
Move from reading to a build-ready project
Use the fabrication and assembly checklists to prepare drawings, production files and test requirements.
Open the DFM checklist