{"id":489,"date":"2020-11-12T07:03:58","date_gmt":"2020-11-12T07:03:58","guid":{"rendered":"https:\/\/swimbi.com\/?p=489"},"modified":"2022-02-24T09:10:42","modified_gmt":"2022-02-24T09:10:42","slug":"assembly-of-electronic-components","status":"publish","type":"post","link":"https:\/\/swimbi.com\/assembly-of-electronic-components\/","title":{"rendered":"All about Assembly of Electronic Components"},"content":{"rendered":"

An electricity-controlled device is known as an electronic component<\/a><\/span>. The electronic components are available in a range of shapes and sizes to carry out various electrical operations. So, a wide range of components is used for electronic devices. This article lists a few of the fundamental features related to electronic components and discusses how these characteristics are essential in the assembly of electronic components.<\/p>\n

Passive and Active Components<\/h1>\n

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A passive component does not provide any sort of signal gain or power amplification. Examples of passive components may include inductors, resistors, capacitors, and memristors. Since the gain of passive components remains less than one, they cannot intensify or oscillate an input signal. Simply put, a passive device can only multiply an incoming single with a value that is always less than one.<\/p>\n

Active components can manipulate input signals by controlling voltage and current levels. They can perform a switching action in the circuit by amplifying and interpreting a signal in various ways. Examples of active components include integrated circuits (ICs), transistors, diodes, and silicon-controlled rectifiers (SCRs). Active electronics components are mainly comprised of semiconductor devices. An active device can have a gain of more than one.<\/p>\n

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Discrete and Integrated Components<\/h1>\n

An individual component operating independently within a circuit is known as a discrete component. A capacitor is an example of a discrete component; it stores the charge when current passes through it. A discrete component can either be a passive or active device.<\/p>\n

Alternatively, an integrated circuit (IC) is created when several discrete components are combined, interconnected in a particular way, and packaged in a specialized enclosure to perform a specific function. Common examples of an IC are microcontrollers, microprocessors, and FPGAs.<\/p>\n

Connection Types of the Components<\/h1>\n

The electronic components can generally be connected to the board in one of two ways, through-hole (TH<\/span>) components or surface-mount (SM) components. Through-hole components have leads that are inserted in the holes drilled in the PCB. At the same time, SM components are placed directly on the surface of the PCB. High-density integrated circuit assemblies prefer using SM components. High-density IC assemblies are available with pin-grid arrays with many rows of pins located on the component’s bottom. In SM devices, leadless parts are often possible where no metal connectors pop out of the components’ body.<\/p>\n

Embedded Components<\/h1>\n

The PCBs manufacturers are increasingly using embedded components, especially for producing consumer electronics. Mostly the passive components and the ICs are embedded within a PCB. The embedded components can be integrated into wearable devices, and development costs and production loads are projected to be minimized. In particular, there are three embedding approaches to passive components.<\/p>\n

Embedding Passive Components makes it possible to embed every currently available part. Since holes in the board are made to carry the materials, the board may get thicker. There is no significant decrease in cost.<\/p>\n

Thinner boards are made feasible by embedding advanced thin passive components, and these components may be as thin as 100\u03bcm or less. The resin encloses these thin components to securely embed them as the board layers are assembled, virtually eliminating the need for making holes in the board.<\/p>\n

The printing of Film components simplifies the packaging stage and reduces the assembly cost because many film components are produced in batches. The circuit’s complexity reduces because the number of solder joints is decreased, providing improved joint durability, compact product, and less environmental impacts.<\/p>\n

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Challenges in Component Assembly\"discrete<\/h1>\n

The electronic assembly process has become specialized in recent years. Electronic has become very sophisticated. The primary stages of manufacturing an electronic product are idea, design, plan, and produce. First, the specifications of an idea are laid out, and initial planning is done. Second, the design stage specifies the device functionality. Third, the planning stage involves selecting appropriate components and their position on the board, routing traces to connect different components, and deciding connectors for multiple PCBs.<\/p>\n

With the increase in electronic equipment complexity, electronic design automation (EDA) has been developed to assist in the design, manufacturing, and assembly of electronics. Today, electronic products are expected to be more compact, high speed, less power consuming, lightweight, and rich in functionality.<\/p>\n

Previously, most circuit boards were used for a single function, such as processor board or power supply board. Meanwhile, every PCB only had a definite role within the overall design; developing and manufacturing were markedly easy. low volume PCB assembly<\/a><\/span>\uff0cThrough Hole components require wider pin-to-pin distance and relatively greater hole diameter limiting its use in high-density component assemblies.<\/p>\n

Pin-to-pin pitches started to shrink with the introduction of surface mounting technologies. The surface-mounted components offered lesser foot-prints and higher pin counts. Trace widths and clearances reduced, making assemblies very compact. With the continued advancement in integration and interconnection, more extensive subsystems can be mounted on an individual chip in a compact package.<\/p>\n

A variety of these compact packages can be combined and mounted on a minimal board to produce an incredibly complex intricate system. These days, multiple sections with very different functionality can exist on a single board. These sections may include a GHz RF section, a section for analog and digital components, and a power supply section. \u00a0PCB designers and manufacturers use ball grid arrays (BGAs) due to their small size, improved performance, and lower power loss. The BGAs are denser than quad flat packages (QFPs), and a micro-packaged \u03bcBGA-IC contains thousands of pin-outs.<\/p>\n

Using these high-density packages contributes to very dense and complex structures, all crammed together using micro-via and advanced box build technologies on a multi-layer PCB. For component assemblers, PCB designers, and manufacturers, all these specifications present significant challenges.<\/p>\n

Process of Electronic Component Assembly<\/h1>\n

The conventional component assembly approach connects the components<\/a> with PCBs by inserting their leads into holes in the PCB. The leads are then soldered to the PCB, providing both mechanical support and electrical connection. \u00a0Later, the surface mount component assembly enabled the utilization of micro-electronics with VLSI IC packages containing huge pin-out numbers.\u00a0 Surface-mount equivalents of all the components are not available, however. So, the PCBs still contain both types of components.<\/p>\n

It is possible to manually put together a PCB assembly<\/a>. However, specialized machines that render the assembly process automated, fast, and secure are more common. Because the final assembly comprises several different kinds of components with different specifications, it is crucial to carefully choose an assembly process based on cost-effectiveness and efficiency. A standard component assembly would contain a range of dual-in-line packages (DIPs), various connectors, and other discrete components such as diodes, capacitors, resistors, and transistors. For their legs to be mounted, all these components have standard hole spacing needed. Simply put, the component assembly process comprises the subsequent phases:<\/p>\n