A PCB solder stencil and solder paste are different products. The stencil is tooling that defines where paste is deposited; the paste is a material used to form soldered connections. A board assembler may purchase both without manufacturing either, so supplier lists should distinguish those roles.
What each supplier provides
StenTech’s official portfolio includes laser-cut and other SMT stencil constructions. Indium Corporation’s technical information describes solder paste as solder powder combined with a flux vehicle. These are separate manufacturing disciplines with different product specifications.
When requesting a quotation, identify whether you need a stencil, paste, a printing-process review or a complete assembly service. Calling all of them “stencil paste” can send the inquiry to the wrong supplier and obscure the information needed.
Coordinate the specifications
| Stencil discussion | Paste discussion |
|---|---|
| Approved aperture data | Selected alloy and flux system |
| Thickness and any stepped areas | Powder type appropriate to the application |
| Frame and printer compatibility | Storage and working conditions |
| Board and component geometry | Reflow and residue requirements |
| Tool identification and revision | Batch identity and shelf-life information |
The assembler should review these choices together. A stencil suitable for one paste and printing setup should not be assumed to reproduce the same result after an uncontrolled material change.
Prepare the tooling request
Supply the relevant board revision, paste-layer data and printer requirements. Identify components that need special aperture review. Ask the stencil maker to return proposed changes for approval and keep the final aperture file with the assembly release.
Do not assume every copper pad receives an identical aperture or that a generic thickness suits all packages. The printing process needs a coherent proposal based on the actual board.
Control paste as a production material
Follow the selected manufacturer’s instructions for storage, preparation and handling. Avoid inventing a universal warm-up time or reuse rule. Record the material identity so printing and soldering issues can be investigated against the actual batch.
Any change in paste should receive the assembler’s process review. A similar label does not establish identical behavior in the existing setup. Keep the accepted material designation on the work instruction.
Judge the combination by results
Evaluate the deposited paste and the assembled joints using the agreed process checks. Record adjustments and preserve the successful setup. The objective is a repeatable print-and-assembly process, not selecting a stencil maker or paste brand from an unsupported ranking.
Primary references: StenTech stencil portfolio and Indium solder-paste composition guidance. See the stencil planning guide.
Move from reading to a build-ready project
Use the fabrication and assembly checklists to prepare drawings, production files and test requirements.
Open the DFM checklist