Recheck Via Tenting When Moving a KiCad Design Between Versions

A design migration can preserve copper connectivity while changing how solder-mask intent is controlled. Via tenting deserves a targeted output comparison because its effect may be small on a crowded board view yet significant to the fabrication instruction. Review the actual exported mask layers.

Locate the effective control

KiCad 9 documents a tenting-control change from a former plotting option to board settings with per-via overrides. Establish the originating and destination versions before assuming an old export checklist still describes the active controls.

Record the global front and back settings, then identify vias with local exceptions. Inspect a small set representing both ordinary vias and intentionally exposed ones. If all selected examples inherit the global default, the review may miss the only override that matters. Include vias used for probing or another special process requirement.

Compare geometry by board side

1. Retain the last approved mask outputs as the comparison baseline.
2. Generate new outputs from the migrated design with documented settings.
3. Overlay or compare the front and back mask layers independently.
4. Inspect each changed via opening against its intended requirement.
5. Resolve unexpected differences in native settings and regenerate the release.

Use the mask-override review to understand precedence. A visible opening in the editor should still be verified in the manufacturing output, and a missing mask opening should not be described as proof of a physically filled via.

Keep fabrication terminology precise

For example, a design may require one side of selected vias to remain exposed for access while the other side follows the board-wide tenting choice. Applying one global setting to make a preview look tidy would erase that intent. Correct the relevant side and objects explicitly, then document the exception.

Tenting, plugging, filling, and capping are distinct fabrication requirements. If the board needs more than a solder-mask instruction, confirm the specified process with the supplier. The fabrication release package should contain the applicable drawing requirements as well as the mask data.

Retain the comparison results and the software version with the release. If the migration intentionally changes tenting, treat that as a reviewed design change. A successful file conversion and a clean connectivity check do not establish that solder-mask details remained unchanged.