A localized ionic measurement answers a question about the region that was extracted. Define that region before interpreting the reported concentration. A result from a small suspect area and an average from the whole board can both be correct while describing different distributions of residue.
Choose the region from the failure question
Mark the affected conductors, component boundaries and neighboring features on a board image. Explain whether the concern is a specific leakage path, a cleaning shadow or a broader process condition. Ask the laboratory which extraction method can represent that area.
Zestron’s ion-chromatography description distinguishes full-board and localized extraction and explains that individual ionic species can be quantified. The extraction choice therefore belongs with the result; it is not simply a different way to generate an interchangeable cleanliness number.
Specify what enters the extraction
| Item | Record |
|---|---|
| Physical boundary | Actual region and board side |
| Assembly state | Components and protective materials present |
| Method | Laboratory extraction and analytical procedure |
| Normalization | Area or other basis used in the reported units |
| Controls | Blanks and reference samples selected by the laboratory |
Keep the sample’s prior washing or handling history visible. A board cleaned for photography before submission no longer represents the residue condition observed when it failed.
Interpret a local result locally
Compare equivalent regions on affected and unaffected samples where the investigation supports that approach. Do not expand a local reading into an assumed total amount for the entire board without a justified sampling model.
For example, a small residue concentration near a connector may be diluted in a full-board extraction. The difference between local and whole-board results does not necessarily mean either analytical method failed.
Conversely, a high local reading does not alone establish the failure mechanism. Relate the identified species and location to the product’s electrical conditions and relevant reliability evidence.
Keep the laboratory’s extraction sketch with the numerical report. If a fixture seal or component boundary changes the wetted area, preserve that detail rather than calculating normalized results from a nominal rectangle that the method did not actually sample.
Use consistent sampling for a process comparison
When testing a cleaning change, retain the same extraction boundary and represented assembly state. If the method changes, report that change and determine whether the earlier results remain comparable.
Set acceptance with the product’s agreed requirements and the responsible specialists. Do not invent a universal limit from a value observed on one successful board.
The component-removal guide addresses access changes during sampling, while low-standoff cleaning review connects the analytical question to the physical cleaning route.
Move from reading to a build-ready project
Use the fabrication and assembly checklists to prepare drawings, production files and test requirements.
Open the DFM checklist